Semiconductor & Microelectronics
ASML-Approved
The Double-Melt Seamless MS4 series is the pinnacle of fluid handling for the semiconductor and microelectronics industries. Engineered for the most aggressive specialty gas environments, MS4 utilizes a rigorous VIM/VAR (Vacuum Induction Melt / Vacuum Arc Remelt) process to ensure absolute material integrity and the lowest possible inclusion levels.
| Superior Material Science & Surface Integrity | |
|---|---|
| VIM/VAR Double-Melt | Sourced from the finest Japanese pre-materials, our double-melt process eliminates impurities, providing superior corrosion resistance and weldability for critical gas process systems. |
| Size Range | Outer diameters (OD) from 1/4" (6.35mm) to 1" (25.4mm) with Wall Thickness (WT) of 0.035” (0.089mm) to 0.065” (1.65mm) are offered. |
| Superior Roughness | Internal Diameter (ID) surface roughness is guaranteed at ≤ 5 Ra (0.127 μm), providing an ultra-smooth, non-reactive path for specialty gases. |
| Global Compliance | Fully manufactured and certified according to ASTM A213, A269, A270, ASME B31.3, and JIS G3459 to ensure seamless integration into global fab architectures. |
| Strategic Industry Applications | |
|---|---|
| Wafer Fab Systems | The definitive solution for sub-atmospheric and high-pressure specialty gas delivery lines within the wafer fab. |
| Tool Hook-up & Cabinets | Optimized for precision tool hook-up installations and gas cabinet manufacturing where zero-contamination is mission-critical. |
Samsung-Approved
The Single-Melt Seamless MS3 series is a certified Ultra-High Purity (UHP) tubing solution qualified by Samsung Electronics and engineered for the rigorous demands of the global semiconductor and microelectronics industries. Sourced from the finest Single-Melt 316L pre-materials, MS3 provides a balance of exceptional material integrity and cost-effective performance for critical process gas delivery.
| Certified Quality & Material Integrity | |
|---|---|
| Samsung Qualified | MS3 is a certified solution for high-purity fluid handling, meeting the stringent quality benchmarks of the world's leading wafer fabrication facilities. |
| Superior Roughness | Every tube is guaranteed an Internal Diameter (ID) surface roughness of ≤ 10 Ra (0.254 μm), ensuring low particle entrapment and efficient gas flow. |
| Precision Manufac. | Produced in strict accordance with ASTM A213, A269, A270, ASME B31.3, and JIS G3459, ensuring global compatibility with UHP infrastructure. |
| Corrosion Resistance | Specifically designed to withstand the chemical demands of specialty gases used in flat panel displays (OLED), microelectronics, and wafer fabs. |
| Industrial Applications | |
|---|---|
| Gas Process Systems | The primary choice for critical gas delivery and bulk distribution systems where high purity and material traceability are non-negotiable. |
| Tool Hook-up & Install | Reliable performance for precision hook-up applications, ensuring a clean, leak-tight environment for sensitive semiconductor tools. |
| Technical Specifications | |
|---|---|
| Stock Availability | Standard lengths at 20-ft (6096mm), 6000mm, and 4000mm to facilitate seamless global project logistics. |
| UHP Material Source | Exclusively utilizes high-grade 316L from Japan to ensure consistent weldability and chemical stability. |
Ultra High-Purity (UHP) Electro-polished (EP) Stainless Steel Tubing
ASML-Approved
The Double-Melt Seamless MS4 series is the pinnacle of fluid handling for the semiconductor and microelectronics industries. Engineered for the most aggressive specialty gas environments, MS4 utilizes a rigorous VIM/VAR (Vacuum Induction Melt / Vacuum Arc Remelt) process to ensure absolute material integrity and the lowest possible inclusion levels.
| Superior Material Science & Surface Integrity | |
|---|---|
| VIM/VAR Double-Melted 316L | Sourced from the finest Japanese pre-materials, our double-melt process eliminates impurities, providing superior corrosion resistance and weldability for critical gas process systems. |
| Size Range | Outer diameters (OD) from 1/4" (6.35mm) to 1" (25.4mm) with Wall Thickness (WT) of 0.035” (0.089mm) to 0.065” (1.65mm) are offered. |
| Superior Surface Roughness | Internal Diameter (ID) surface roughness is guaranteed at ≤ 5 Ra (0.127 μm), providing an ultra-smooth, non-reactive path for specialty gases. |
| Global Standard Compliance | Fully manufactured and certified according to ASTM A213, A269, A270, ASME B31.3, and JIS G3459 to ensure seamless integration into global fab architectures. |
| Strategic Industry Applications | |
|---|---|
| Wafer Fabrication Systems | The definitive solution for sub-atmospheric and high-pressure specialty gas delivery lines within the wafer fab. |
| Tool Hook-up & Gas Cabinets | Optimized for precision tool hook-up installations and gas cabinet manufacturing where zero-contamination is a mission-critical requirement. |
| Semiconductor Test Equipment | Reliable fluid handling for the high-duty cycles of semiconductor testing environments. |
Samsung-Approved
The Single-Melt Seamless MS3 series is a certified Ultra-High Purity (UHP) tubing solution qualified by Samsung Electronics and engineered for the rigorous demands of the global semiconductor and microelectronics industries. Sourced from the finest Single-Melt 316L pre-materials, MS3 provides a balance of exceptional material integrity and cost-effective performance for critical process gas delivery.
| Certified Quality & Material Integrity | |
|---|---|
| Samsung Electronics Qualified | MS3 is a certified solution for high-purity fluid handling, meeting the stringent quality benchmarks of the world's leading wafer fabrication facilities. |
| Size Range | Outer diameters (OD) from 1/4" (6.35mm) to 1" (25.4mm) with Wall Thickness (WT) of 0.035” (0.089mm) to 0.065” (1.65mm) are offered. |
| Superior Surface Roughness | Every tube is guaranteed an Internal Diameter (ID) surface roughness of ≤ 10 Ra (0.254 μm), ensuring low particle entrapment and efficient gas flow. |
| Precision Manufacturing | Produced in strict accordance with ASTM A213, A269, A270, ASME B31.3, and JIS G3459, ensuring global compatibility with UHP infrastructure. |
| Corrosion Resistance | Specifically designed to withstand the chemical demands of specialty gases used in flat panel displays (OLED), microelectronics, and wafer fabs. |
| Industrial Applications | |
|---|---|
| Gas Process Systems | The primary choice for critical gas delivery and bulk distribution systems where high purity and material traceability are non-negotiable. |
| Tool Hook-up & Installation | Reliable performance for precision hook-up applications, ensuring a clean, leak-tight environment for sensitive semiconductor tools. |
| Gas Cabinets & Equipment | Extensively used in the manufacturing of gas cabinets and semiconductor test equipment requiring high-integrity fluid paths. |
| Technical Specifications | |
|---|---|
| Dimensions | Outer diameters ranging from 1/4” (6.35mm) to 1-1/2” (38.1mm). |
| Stock Availability | Standard lengths at 20-ft (6096mm), 6000mm, and 4000mm to facilitate seamless global project logistics. |
| UHP Material Source | Exclusively utilizes high-grade 316L from Japan to ensure consistent weldability and chemical stability. |
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Copyright © 2023 WSG All Rights Reserved
